AmpliTech Group, Inc's (NASDAQ: AMPG) Spectrum Semiconductor Materials division collaborated with NGK Electronic Devices, a company in the semiconductor packaging industry, to become their U.S.

StratEdge debuts advanced molded ceramic packages for next-gen high-power devices at IMAPS & GOMACTech 2025, featuring an updated MC Series datasheet.

SANTEE, Calif., June 12, 2025--StratEdge celebrates 40 years at IMS 2025, showcasing high-reliability ceramic packages used in telecom, defense, 5G—and even on the Mars Rovers.

StratEdge packages for high-frequency, very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15 in Tel Aviv, Israel.

SANTEE, Calif., June 13, 2024--StratEdge will display high-performance packages for high-frequency, high-power, and high-reliability at #IMS2024, Booth 515, June 18-20 in DC.

PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic semiconductor packaging. This development follows PanelSemi's 2024 ...

HyperBGA, a PTFE-based, coreless semiconductor package, allows silicon devices to run at speeds surpassing 12 Gb/s. ... PTFE Package Challenges Ceramic BGAs. July 2, 2007.

TIJUANA, Mexico---- In a tribute to industrial innovation and technology, Mexican President Felipe Calderón today used ceramic scissors from Kyocera in a ribbon cutting ceremony to inaugurate the ...

StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336. Celebrating a legacy of high-reliability packaging— from powering Mars Rovers to advancing today’s telecom, defense, and 5G systems ...