Commercially available, Hysol QMI529LS die-attach material and Hysol GR828A mold compound are lead-free compatible and designed for thin and ultra-thin surface-mount device applications ...

More information: Shengkun Ni et al, Identifying compound-protein interactions with knowledge graph embedding of perturbation transcriptomics, Cell Genomics (2024). DOI: 10.1016/j.xgen.2024.100655 ...

Inserted unobtrusively in critical locations, these metal-embedded micro-thin film thermocouples could more effectively monitor conditions and diagnose problems during manufacturing processes such ...