G.SKILL Unveils Newly Enhanced DDR5 R-DIMM Memory with 16-Layer PCB for Improved Signal Integrity and Enhanced Voltage Protection via Two Transient Voltage Suppression Diodes and a Fuse.

That is impressive, with around 10% thermal reduction on XPG's overclocked DDR5 memory modules. It results in a cooling upgrade like an AIO for a high-end CPU, but with just some new thermal coating.

Based on the newly released JEDEC revision standards for DDR5 R-DIMM, the new G.SKILL R-DIMM memory features a 16-layer PCB for improved signal integrity, as well as adding two transient voltage ...

In a new leak we're getting to see the purported ASUS X670 Prime motherboard through a PCB diagram, with 4 x DDR5 memory slots and a single PCIe 5.0 x16 slot. ASUS is using a 14-phase VRM design.

It also allows for higher density, with up to 128GB of DDR5 on one PCB. That PCB then goes into the CAMM. To achieve that density with a SO-DIMM would require four 32GB modules, mounted on both ...

Improved Signal Integrity with 16-Layer PCB. These new DDR5 R-DIMM memory modules feature an advanced 16-layer PCB, a significant upgrade from previous 8- or 10-layer designs.