This includes traditional optical inspection tools in the in-line production flow ... The WLP, which is still on a wafer-like format, is diced using mechanical or laser dicing techniques. This is ...

DXB is designed to bond wafers using WaferGrip Temporary Adhesive. Dynatex International supplies WaferGrip in various preformed shapes and sizes to suit the required application. This along with the ...

The global dicing tapes market revenue was around US$ 1,311.9 million in 2021 and is estimated to reach US$ 2,366.5 million by 2031, growing at a compound annual growth rate (CAGR) of 6% during the ...

LPC sees significant upside potential from these under-invested product lines and is driving for ... its R&D efforts for the BlackStar laser wafer dicing product and CMS’ semiconductor systems.

In its 2018-2022 Global Wafer Capacity report, IC Insights shows that new manufacturing lines are expected to boost industry capacity 8% in both 2018 and 2019 (Figure 1). From 2017-2022, annual growth ...