Find out PCB design strategies to reduce EMI in 800G systems while maintaining high performance in data center and telecom ...

PCB Design. PCB thickness; Mount point locations; Optimize your PCB design for thermal environments. Temperature cycling is the most common cause of electronic failure. It is typically caused by a ...

During a thermal cycling event, you can see the high-strain areas (indicated by red and yellow) that develop. Placement of the QFN in the resulting high-strain area could lead to solder joint failure ...

Figure 4: Failing polymer fuse (F18) and thermal damage to the PCB and capacitor (C33) Figure 5 shows a damaged resistor. ... 0 comments on “ PCB failure: Electrical overstress assessment ” Leave a ...