The PlasmaPro 100 Cobra ICP RIE system uses a high-density that has been inductively coupled plasma for quick etch rates to be obtained. The process modules provide high-throughput, outstanding ...

The Trion ICP/RIE Etch PHTII-4301 (TRION) is a reactive ion etcher with the addition of a inductively coupled plasma to achieve a high density plasma for enhanced anisotropic etching. This system is ...

Etching Etching is a way of removing a material through either chemical or physical means. There are many ways etching of the surface a material can be performed, but in the world of nanoscale etching ...

An example of how the RIE etch depth can vary as a function of feature dimension is illustrated in Figure 1. This phenomenon is called RIE lag or ARDE (aspect ratio dependent etching), and it occurs ...

Plasma reactive-ion etching systems incorporate several steps to the integrated circuit fabrication process. Reactive plasm, deposited onto the wafer, removes and refines excess material to “etch” or ...