Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor ...

Back-end equipment segment expansion is expected to continue in 2026, with test equipment sales rising 5.0% and assembly and ...

OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems. PR Newswire. SANTA CLARA, Calif., March 31, 2025.

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method —Contributing to the cost reduction of ...

With construction now well underway on all three planned fabs, TSMC’s Arizona campus will be potentially positioned as the ...

Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not ...

Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus ...

This admission, made public in a regulatory filing, marks a notable shift for the chipmaker, which has traditionally set the ...

SEOUL, June 24 (Yonhap) -- SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.

Partnership provides a solution, combining OSAT (Outsourced Semiconductor Assembly and Test) services with advanced Tx engine designs for optical communication systems, streamlining the production ...