OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems. PR Newswire. SANTA CLARA, Calif., March 31, 2025.

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method —Contributing to the cost reduction of ...

Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus ...

SEOUL, June 24 (Yonhap) -- SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor ...

Furthermore, even the back-end process is now required to be as clean as the front-end process. Therefore, the soot which is generated by the conventional laser ablation debonding method has not ...

Back-end equipment segment expansion is expected to continue in 2026, with test equipment sales rising 5.0% and assembly and ...

Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first ...

Partnership provides a solution, combining OSAT (Outsourced Semiconductor Assembly and Test) services with advanced Tx engine designs for optical communication systems, streamlining the production ...