From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

How much does it cost TSMC to start up its new chip-manufacturing plants on US soil? According to a new study by TechInsights ...

Eventually – not too far into the future – the quantum and thermodynamic effects of single silicon atoms (which have a diameter of 0.26 nanometers) will stop the etching from going any smaller.

Curiosity about a mistake that left tiny dots on a germanium wafer with evaporated metal films led to the discovery of ...

The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective ...

Doubling etch rates When silicon nitride and silicon oxide were tested separately, the etch rate increased for the nitride and the oxide layer using the hydrogen fluoride plasma instead of the ...

The Global Semiconductor Wafer market is projected to grow significantly, from 24,362.2 million in 2025 to 42,987.0 million ...

South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of plasma ...

An Australian-Russian research group has developed a silicon heterojunction solar cell based on p-type gallium-doped wafers with an efficiency of 22.6% and an improved stability. The scientists ...