The adhesive, typically an organic thermoset or thermoplastic material, is spin coated on the carrier wafer, while a much thinner debonding material is often spin coated on the device wafer. Bonding ...

Scientists in China have discovered a better way to build small, high-performance electronic parts using ultra-thin materials ...

However, there is a little-known Huawei-linked company, Si Carrier Technologies, that has revealed it has almost all types of wafer processing ... Applied Materials, KLA, and Lam Research ...

Researchers in China have developed a cutting-edge wafer-scale method to transfer 2D semiconductors like graphene with minimal defects, paving the way for high-performance, low-power electronic and ...