ALBANY, New York, March 3, 2017 /PRNewswire/ --With Disco Corp. holding more than half of the global market for thin wafer processing and dicing e ...

ORLANDO, Fla., November 01, 2024--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for ...

Fonon's Wafer Dicing System incorporates Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials without generating a visible seam.

ORLANDO, Fla., August 09, 2024--Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming increasingly thin.

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...