ORLANDO, Fla., November 01, 2024--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for ...

ORLANDO, Fla., August 09, 2024--Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer ...

Fonon's Wafer Dicing System incorporates Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials without generating a visible seam.

ALBANY, New York, March 3, 2017 /PRNewswire/ --With Disco Corp. holding more than half of the global market for thin wafer processing and dicing e ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...