The adhesive, typically an organic thermoset or thermoplastic material, is spin coated on the carrier wafer, while a much thinner debonding material is often spin coated on the device wafer. Bonding ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

Scientists in China have discovered a better way to build small, high-performance electronic parts using ultra-thin materials ...

Two-dimensional (2D) semiconductor materials could enable the development of smaller yet highly performing electronic components, thus contributing to the advancement of a variety of devices. While ...

A new method makes it possible to combine 2D materials with insulators—opening the door to smaller, faster electronics. Read ...