Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

Two-dimensional (2D) semiconductor materials could enable the development of smaller yet highly performing electronic components, thus contributing to the advancement of a variety of devices. While ...

“Thereby, the long-term stability of material quality was analyzed in terms of charge carrier lifetime for wafers ... extent in current industrial wafer material.” Over time, LeTID can cause ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform,” 2024 IEEE 26th Electronics ...

Strong growth in PLP market with a 27% CAGR from 2024 to 2030, driven by its cost efficiency and ability to meet both ...