China's continued investment in mature semiconductor foundry capacity has become a focal point in the industry. Many worry ...

Intel delivered better-than-expected revenue for its second quarter and issued a fairly positive outlook for its third ...

Ultrathin dies require a Cu stabilization layer, which is essentially a backside Cu layer, to prevent warpage and cracks during solder die attach and wire bonding. The dicing of Si wafers with a ...

Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been performed. Several dicing technologies such as ...