China's continued investment in mature semiconductor foundry capacity has become a focal point in the industry. Many worry ...

Intel delivered better-than-expected revenue for its second quarter and issued a fairly positive outlook for its third ...

Ultrathin dies require a Cu stabilization layer, which is essentially a backside Cu layer, to prevent warpage and cracks during solder die attach and wire bonding. The dicing of Si wafers with a ...

Zero defect in semiconductor packaging is key especially for high demanding reliability applications (automotive, spatial...) combined with high performance technologies (Silicon ultra lowK wafers ...

The two remaining EPC contractors for the QatarEnergy-operated three-train Golden Pass LNG project continue to progress construction on the project and are now close to finalising terms for their ...