Thermal stress of the power semiconductor is one of the most important indicators for the reliability assessment of power electronics-based power systems. The mapping of the Insulated-Gate Bipolar ...

Consequently, this study focuses on the recently developed copper diffusion bonding (diff. bond.) method. Using three different spools, the properties of the copper diff. bond. joints are compared to ...

BELLEVUE, Wash. — Copper thieves have targeted Sound Transit lines multiple times in the past week, causing significant disruptions to service and raising safety concerns for riders. Police are ...