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New chip tests cooling solutions for stacked microelectronics - MSNNow, MIT Lincoln Laboratory has developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, mimicking high-performance ...
Apple silicon chips are found in iPhones, iPads, Macs, and other devices, but it's unclear exactly which chips will be packaged at the new facility in Arizona. Tag: Apple Silicon Guide [ 97 comments ] ...
Nvidia to use optical tech in networking chips, not GPUs Copper cables currently more reliable than optical connections Nvidia has backed startups working on co-packaged optics for AI chips SAN ...
IBM Research has developed co-packaged optics, new chip assembly and packaging advancements that could increase “beachfront density” - number of optical fibers that can connect at a chip’s ...
IBM’s Co-Packaged Optics Prototype Packs More Bandwidth Into a Single Connector Your email has been sent Polymer optical waveguides in co-packaged optics could speed up AI training. On Dec. 9 ...
The technology, called 3.5D XDSiP, will allow Broadcom's custom-chip customers to boost the amount of memory inside each packaged chip and speed up its performance by directly connecting critical ...
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