SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming increasingly thin.

The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws.

We demonstrate that counterintuitively, silicon wafer stealth dicing can be performed with femtosecond laser pulses at 1030-nm, where linear absorption predominates.

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt.

Certain non-killer but marginal wafer defects can escape detection if they have sufficient electrical connectivity.

Silicon Valley startup xLight has raised $40 million, aiming to build the first prototype of a new class of laser that could ...

In the semiconductor space, laser technology is increasingly utilized for tasks such as marking, dicing, and scribing.These solutions, integrating lasers spanning from ultraviolet to far-infrared ...

Multi-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size ...

New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.

Discover the Photon Matrix, a laser device designed to detect and eliminate mosquitoes with precision, offering a futuristic pest control solution.

Recent supply chain rumors have indicated that TSMC will withdraw from the gallium nitride (GaN) market, a third-generation semiconductor material, with related production lines at its Hsinchu ...