CEO Michael Plisinski highlighted a record quarterly revenue of $264 million for Q4 2024, attributed to strong AI packaging demand and growth in the specialty and advanced packaging markets. He ...

Q4 2024 Management View CEO Bertrand Loy announced a strong performance in Q4 2024, with revenue excluding divestitures growing 11% year-on-year, surpassing expectations. He highlighted record sales ...

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its new state-of-the-art production and R&D ...

M, Inc. (St. Paul, Minn.) is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 ...

Strengthening Advanced Packaging Innovation Across Borders: Summary The US-JOINT consortium unites 10 leading semiconductor firms from Japan and the U.S. to d ...

For Q2 2025, the company projects revenue between $21 million and $23 million, with adjusted EBITDA expected to be nominally positive. Management remains cautious due to ongoing market softness but ...

Opportunities exist for refillable/reusable food and beverage packaging, but much like recycling, success depends on the ease of the systems designed for consumers to ...

Apple has reportedly started mass production of its next-gen M5 processor: will power new MacBook Pros, iPad Pros, and new ...

Discover how smart packaging, AI, and light therapy are revolutionising beauty, enhancing skin care efficacy, sustainability, ...

AblePrint Technology (APT), a supplier of pneumatic and thermal process solutions for semiconductor packaging, has reported ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

Harpak-ULMA has unveiled the ARTIC SS Chevron, an advanced horizontal flow wrap machine tailored for medical and ...