According to research firm Astute Analytica, the global push towards digitalization, coupled with rising demand for consumer electronics and miniaturization, is expected to boost the global wafer ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming increasingly thin.

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt.