Ultrathin dies require a Cu stabilization layer, which is essentially a backside Cu layer, to prevent warpage and cracks during solder die attach and wire bonding. The dicing of Si wafers with a ...

Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been performed. Several dicing technologies such as ...

Rapidus has begun prototyping 2nm gate-all-around transistor structures at its IIM-1 fab in Japan as it prepares for 2027 ...