News
Ultrathin dies require a Cu stabilization layer, which is essentially a backside Cu layer, to prevent warpage and cracks during solder die attach and wire bonding. The dicing of Si wafers with a ...
Tom's Hardware on MSN5d
Japanese chipmaker Rapidus begins test production of 2nm circuits — company commits to single-wafer processing ahead of 2027 mass production targetRapidus has begun prototyping 2nm gate-all-around transistor structures at its IIM-1 fab in Japan as it prepares for 2027 ...
IEEE Spectrum on MSN6d
2D Transistors Could Come Sooner Than ExpectedCDimension has developed a process for growing molybdenum disulfide (MoS2), a 2D semiconductor, on silicon at a low-enough temperature that it will not damage underlying silicon circuits. That could ...
Zero defect in semiconductor packaging is key especially for high demanding reliability applications (automotive, spatial...) combined with high performance technologies (Silicon ultra lowK wafers ...
The two remaining EPC contractors for the QatarEnergy-operated three-train Golden Pass LNG project continue to progress construction on the project and are now close to finalising terms for their ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback