Additive manufacturing is reshaping aerospace, offering tailored solutions and reducing material waste, crucial for the ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Guidance for assemblable parts is a promising field for augmented reality. Augmented reality assembly guidance requires 6D object poses of target objects in real time. Especially in time-critical ...

Scientists have established a new design strategy for building 3D materials and devices in a bottom-up manner, using a set of nanoscale DNA-guided components. This "DNA origami" approach could ...

Hierarchical, context-aware analysis for modern 3D assemblies A chip-level 3D stress analysis software would model all elements of the packaged stack, from millimeter-scale substrates down to ...

Demonstration of Nonvolatile Storage and Synaptic Functions in All-Two-Dimensional Floating-Gate Transistors Based on MoS2 Channels ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics.

This paper presents a robot automatic perception and assembly method for the situation that the measurement and assembly processes are not conducted at the same workstation. This method allows the ...

Best Buy Drops $200 Off the Bambu P1S 3D Printer During Bambu Lab's 3rd Anniversary Sale The P1S combo includes the AMS module for multi-material and multi-color printing.