AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress ...

Faced with slumping quarterly sales and a burgeoning loss, Intel shareholders will want to know new CEO Lip Bu-Tan's plans ...

The new chip integrates quantum light sources and electronic controllers using a standard 45-nanometer semiconductor process. This approach paves the way for scaling up quantum systems ...

An interdisciplinary academic team has successfully integrated quantum light sources and control electronics onto a single ...

State documents show that Michigan was willing to exchange billions in cash and tax breaks to land a proposed semiconductor ...

Smartkem Chairman and CEO, Ian Jenks, comments: "This joint development agreement builds on our collaboration with Manz Asia which has already resulted in our first demonstration at SEMICON® SEA ...

Together, we intend to develop scalable, high-performance solutions that address the critical bottlenecks particularly in advanced computer and AI chip packaging.

Smartkem Announces Preliminary Joint Development Agreement with Manz Asia for Advanced Computer and AI Chip Packaging Solutions PR Newswire MANCHESTER, England, July 9, 2025 ...

Optical interconnects offer a promising solution to achieve a larger bandwidth distance product, interconnect density and power efficiency compared to their electrical counterparts. The development of ...