Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...

She is dicing with death.", reports the Mirror. Adding to the anxiety is the rising concern within Katie's family circles, as insiders allege they fret over her ability to withstand another ...

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Camtek's systems inspect IC and measure IC features on ... end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market ...

Traditionally, to develop a complex IC product, vendors designed a chip that integrated ... It also requires KGD, different die sizes, and dies from different technology nodes or wafer sizes. Dicing, ...

At some point, the wafer or a wafer-like structure is diced into individual dies or IC packages, depending on the process. The dicing step can cause defects as well as sidewall cracks on selected ...

Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...

June 25, 2014-- Semiconductor manufacturers closed 72 wafer fabs between 2009-2013 and another nine fabs are slated to close in 2014, according to data recently compiled, updated, and now available in ...