The eutectic die bonder was designed for the manufacture of Chip-on-Submount (COS) assemblies. It uses high precision metrology in combination with a high performance motion system for sub-micron ...

A common task in the most diode laser assemblies is the joining of a laser diode chip to a submount or heat spreader. Especially for single emitter layouts this process is quite similar throughout the ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

With up to 20 blue laser chips packed into a single package for projection applications, compact laser module doubles the optical output of the individual chips, resulting in an overall blue light ...

Munich, Germany / Stockholm, Sweden – Infineon Technologies announces the industry first intelligent Laser Diode Driver (iLDD) targeting Small Form Factor (SFF) and Small Form Pluggable (SFP) optical ...

Milpitas, Calif. – Elantec Semiconductor Inc. is billing its EL-6287C laser diode driver as a lower-cost, better-performing replacement for its EL6257C. The CMOS part, priced at $2.50 in quantities of ...

A Mordor Intelligence report notes the global laser diode market will grow at a CAGR of 11.2% between 2021–26 to reach US$16.3bn by 2026. Read to know more.

image: Schematic view of the final gas sensing microsystem based on a low-cost polymer microresonator and the use of a vertical laser diode (VCSEL) as a probing source. view more Credit: The ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO:6503) announced today that it will begin shipping samples of its new tunable laser-diode chip for use in optical transceivers of ...

This is very difficult to do within the tiny solid-state laser diodes that are very useful in metrology. Currently, the light from laser diodes is improved externally using optical modules. This added ...