Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System November 01, 2024 04:58 PM Eastern Daylight Time ...

In the semiconductor space, laser technology is increasingly utilized for tasks such as marking, dicing, and scribing.These solutions, integrating lasers spanning from ultraviolet to far-infrared ...

Laser Photonics and CMS Laser Optimize Semiconductor Manufacturing With High-Precision Laser Marking, Dicing, Scribing Provided by ACCESS Newswire Jul 8, 2025, 8:40:00 PM ...

Fonon believes it is well-positioned to become one of the top providers of laser-powered wafer dicing systems in the growing semiconductor market over the next few years. Fonon continues to expand ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

Xsil, a maker of laser micro-machining systems that serves the microelectromechanical systems market, among others, also offers a laser tool to drill vias, the Xise200. The company said its dedicated ...

The current standard wafer has a diameter of 8“. The industry is moving towards manufacturing larger wafers. Technologies for production processes such as stealth dicing, lithography, doping, ...

Rudolph and DISCO partner to optimize the wafer saw process through post-saw inspection, real-time monitoring and feedback of dicing tools and wafer-to-process tool correlations.