The interior of B&B Italia. Courtesy of B&B Italia. As part of the Georgetown House Tour’s festivities this year, a design panel will be held this Thursday, April 24 from 5:30-7:30 p.m. at B&B Italia.

But one of the major challenges that still remains is using of FPGA for large SoC design. One of the ... take care special requirement of multi-FPGA designs. For examples Close Communication between ...

OnePlus Nord CE 5 is said to have a MediaTek Dimensity 8350 SoC It may pack a 7,100mAh battery Rear panel design appears different compared to Nord CE 4 ...

In section 5, we will present the implementation results on the Multi FPGA platform. We conclude in the last section. In this section, we present the design of a NoC with 16 masters 16 slaves with the ...

While chips are generally built on 300-millimeter round wafers, TSMC's new technology, referred to in the industry as "panel-level" advanced chip packaging, will use a square substrate that can ...

we design an alternating optimization scheme that iteratively optimizes the rotation angles and beamforming by utilizing semidefinite relaxation (SDR) techniques and the quasi-Newton method. The ...

Siemens Digital Industries Software has completed the acquisition of DownStream Technologies, a provider of manufacturing data preparation solutions for printed circuit board (PCB) design. This ...

This article highlights key design practices for GaN half-bridge converters driven by the LT8418. Optimized PCB layouts, proper capacitor placement, and fine-tuned gate resistors ensure robust ...

This acquisition will help to strengthen Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market. “The acquisition is a significant step ...

Abstract: The compensation and high-efficiency operation of the multi-modular inductive power transfer (IPT ... compared to other circuit-based decoupling methods. Additionally, a design guideline ...